AWG G3 PAD FOR PS3 Specifikace Strana 20

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1 System Overview System Characterization
20 System Reference, January 2001
Technical Highlights
Test Processor-Per-Pin
Architecture
The technology required to address these challenges is a
highly integrated Tester-on-a-Chip. The Test Processor-
per-pin architecture combines all functions of the digital
tester in one chip. This provides the foundation for full,
fast and effective testing of all components integrated into
SOC devices.
Figure 3 Test Processor-per-pin Architecture
Every pin in the Test Processor-per-pin architecture is its
own tester.
System Architecture The Agilent 93000 SOC Series testers combine highest
speed digital test and highest precision analog measure-
ment into a compact testhead.
All testdata stays local
No cable effects
Quiet buses during test
No cross talk between
channels
Highest throughputtest
execution
µProcessor Bus
Formatter
Timing Gen.
Local Control
APG perpin
Pin
Electronic
Local Vector
Memory
To Device
under Test
Master
Clock
Up to 1024 pins
Optical Link to
Workstation
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